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Packaging Details : SMD
Detection color : Black
Gender : Female
Connect-Disconnect Life : 5,000 times
Brand Name : MICROXNJ
Mounting Type : Surface Mount, Right Angle
Operating Temperature : -20℃~+85℃
Delivery Time : 1工作日
Description : USB-Micro B Receptacle Connector 5 Position Surface Mount, Right Angle
MOQ : 20
Stock : 5786
Number of Contacts : 5P
Voltage Rating : 30V
Model Number : MicroXNJ
Current Rating : 1.8A
Connector Type : Micro-B
Number of Ports : 1
Continuous electroplating technology for MICRO XNJ 073 connectors.
SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD
MICRO XNJ 073
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| Material Code | Material Detail | Specification | Unit | Reference Standard |
|---|---|---|---|---|
| LCP UL94V-0 | - | - | - | |
| C5191R-H | Nickel base, Gold plated contact area | 1 | - | |
| H65 | Nickel base plating | 50 | - | |
| H65 | Tin plating | 80 | - |
| Item | Specification and Standard | Test Method and Reference Standard |
|---|---|---|
| 1.8 Ampere | - | |
| -20+85 | - | |
| 50m MAX | Test contact impedance with low power current. Ref: EIA 364-23A | |
| 100M MIN | Test plastic impedance between adjacent contact pins. Ref: EIA 364-21A | |
| 100V DC | Test plastic withstand voltage between contact pins with 0.5mA current for 1 minute. Ref: EIA 364-20A | |
| 300V AC | Test plastic withstand voltage between contact pins with 0.5mA current for 1 minute. Ref: EIA 364-20A | |
| 3kgf MAX | When matched with the wire end, the force when the wire end is inserted at a speed of 25mm/min. Ref: EIA 364-13A | |
| 0.7kgf MIN | When matched with the wire end, the force when the wire end is pulled out at a speed of 25mm/min. Ref: EIA 364-13A | |
| 0.3 kgf MIN | The force of the contact PIN retracting from the plastic at a speed of 25mm/min. Ref: EIA 364-09A | |
| 3000 times | Continuously plug and unplug the product at a uniform speed of 600 times per hour. Ref: EIA 364-28A | |
| Amplitude 1.5mm, Frequency 10Hz to 55Hz to 10Hz cycle, 2 hours for each X/Y/Z direction. | - | |
| Tin coverage 95% | Soak the product's soldering area in a tin bath at 2355 for 50.5 seconds. Ref: MIL STD-202F | |
| Appearance: No obvious damage. Contact Impedance: 100m MAX. Insulation Impedance: 100M MIN. | Place the product in a 85 high-temperature oven for 96 hours, then leave at room temperature for 3 hours for observation. Ref: MIL STD-1344A | |
| Appearance: No obvious damage. Contact Impedance: 100m MAX. Insulation Impedance: 100M MIN. | Place the product in a -40 low-temperature oven for 96 hours, then leave at room temperature for 3 hours for observation. Ref: MIL STD-1344A | |
| Appearance: No obvious damage. Contact Impedance: 100m MAX. Insulation Impedance: 100M MIN. | Place the product in a salt spray chamber with a salt water concentration of 5% and a temperature of 352 for continuous spraying for 12 hours, then observe at room temperature for 1 hour. Ref: EIA 364-31A | |
| Appearance: No obvious corrosion. Contact Impedance: 50m MAX. | Place the product in an environment with a temperature of 402 and humidity of 90-95% RH for 120 hours, then observe. Ref: EIA 364-26A | |
| Appearance: No obvious discoloration or blistering; Solderable area is smooth. | Product soldering area immersed in a tin furnace at 2355 for 50.5 seconds. Ref: MIL STD-202F |
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SHOU HAN MicroXNJ Images |