| Contact Material | Copper Alloy |
| Plating Underplating | See ordering information |
| Wiping Area Plating | See ordering information (L = 8 Min. Gold over 50 Min. Ni; C = 30 Min. Gold over 100 Min. Ni) |
| Solder Tail Plating | Gold Flash over Nickel (RIA E1 & C1 apply) |
| Shroud and Latch Hook Plating | Nickel |
| Ground Lock Plating | Tin in combination with gold flash plated tail |
| Color | See ordering information (Blank = Beige, D = Black for 20 pos. only) |
| Current Rating | 1 A |
| Insulation Resistance | > 5 108 at 500 VDC |
| Withstanding Voltage | 500 VRMS for 1 Minute |
| Temperature Rating | -55C to +105C |
| Process Rating | 260C (profile per J-STD-020C) |
| Contact Quantities Available | 14, 20, 26, 36, 40, 50, 68 |
| Panelmount Thread Size | G = M2.5 (14, 20, 26, 36, 40 pos.); H = #4-40 (20, 36, 50 & 68 pos.) |
| Panel Thickness Max. | .079 [2.00] |
| PC Board Thickness | .062 [1.57] |
| Dimensions (Example: 14 Position) | A: 0.300 [7.62]
B: 0.93 [23.6]
C: 1.16 [29.5]
D: 0.50 [12.6]
E: 0.77 [19.5] |
| Dimensions (Example: 20 Position) | A: 0.450 [11.43]
B: 1.08 [27.5]
C: 1.31 [33.4]
D: 0.65 [16.4]
E: 0.92 [23.4] |
| Dimensions (Example: 26 Position) | A: 0.600 [15.24]
B: 1.23 [31.3]
C: 1.46 [37.2]
D: 0.80 [20.2]
E: 1.07 [27.2] |
| Dimensions (Example: 36 Position) | A: 0.850 [21.59]
B: 1.48 [37.6]
C: 1.71 [43.5]
D: 1.05 [26.6]
E: 1.32 [33.5] |
| Dimensions (Example: 40 Position) | A: 0.950 [24.13]
B: 1.58 [40.2]
C: 1.81 [46.1]
D: 1.15 [29.1]
E: 1.42 [36.1] |
| Dimensions (Example: 50 Position) | A: 1.200 [30.48]
B: 1.83 [46.5]
C: 2.06 [52.4]
D: 1.40 [35.5]
E: 1.67 [42.4] |
| Dimensions (Example: 68 Position) | A: 1.650 [41.91]
B: 2.28 [57.9]
C: 2.51 [63.8]
D: 1.85 [46.9]
E: 2.12 [53.8] |
