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SHETIME TFC7D-N1S1-2000-A

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SHETIME TFC7D-N1S1-2000-A

Height Above Board : 1.8mm

Model Number : TFC7D-N1S1-2000-A

Packaging Details : SMD

Card Connection Mode : Push-Push

Brand Name : TFC7D-N1S1-2000-A

Delivery Time : 3-5工作日

Card Type : MicroSD Card

Stock : 100000

MOQ : 1000

Description : Push-Push 1.8mm MicroSD Card SMD PC Card Sockets RoHS

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Product Specification for Approval

Customer: Customer P/N :

Manufacturer: DONGGUAN GAOYUEDA ELECTRONICS CO.,LTD ()

Taiwan Factory:

Address: NO.95 Twopart Southharbour road,Taibei,Taiwan.CHINA (95 )

China Factory:

Address: 2 9

Part No.: TFC7D-N1S1-2000-A

Description: TF7D (

Product Name: T-Flash type CONN.

Rev: A/0

Material Requirements

Cardboard material:

Cardboard dimensions:

Reel material:

Reel dimensions:

Tape material:

Tape dimensions:

Packaging Method

Place reel into packaging machine, leave empty space at front, product at back, then empty space at back. Leave specified length of tape at the end.

Remove packaged products from packaging machine, package them, and affix inner reel labels.

Stack the accumulated reels into the carton, place cardboard at top and bottom, and insert corner protectors at the four corners of the carton.

Pack and seal the packaged finished products, and affix labels to the outside of the carton.

Carton Specification

Carton size: 340*340*385

Sealing: Carton tape

Labels: Finished product label, cardboard, corner protector

Material Compliance

Harmful material can follow the requirement of RoHS.

Transportation

Any vehicle can be adopted for transportation, but moisture-proof and no mechanical damage.

Storage

Temperature: -25~+85

Relative humidity: 80%

Do not store in corrosive environments.

Re-qualification test shall be conducted immediately if storage duration exceeds 6 months.

Item	Requirements	Test Methods
1. Confirmation of Product	Product shall be conforming to the requirements of applicable product drawing.	Visually, dimensions and functionally inspected per applicable product drawing.
2. Contact resistance (Low Level)	80 m Max. initial	Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max.
3. Insulation resistance	1000 M Min.	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%).
4. Dielectric Strength	Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max..	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector.

Environmental Requirement	Specification	Test Method
Solderability	Connectors solderability can meet MIL-STD-202F standard. Finish shall be free of contaminants.	MIL-STD-202F
Resistance to Solder Heat (Wave Soldering)	Preheat: Increase in temperature not to exceed 4 per second. Final preheat temperature will be within 125 of solder temperature. Soldering: Device leads will be exposed to solder wave at 250 for a maximum of 5 seconds. Cool Down: Cool down in ambient air at approximately 20 to 25.	-
Resistance to Solder Heat (Infrared Reflow)	Preheat: Increase in temperature not to exceed 4 per second. Soldering: Maximum allowable time above reflow temperature of 183 is 90 seconds. Maximum temperature in this interval is 260, not to exceed 10 seconds. Cool Down: Cool down shall not exceed 6 per second.	-
Cleaning (Aqueous Cleaning)	Three cycles; each cycle consisting of a maximum of one minute exposure to 54 to 66 demineralized tap water at a maximum pressure of 30 psi; followed by air drying for 60 to 90 seconds at 93 to 121.	-

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